Method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing a member and the uncured material on a substrate into contact

ABSTRACT

A method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing a member and the uncured material on a substrate into contact with each other is cured. The method includes a step of bringing the member and the substrate near to each other while effecting the alignment control, based on a driving profile, after the alignment control is started, to bring the member and the uncured material into contact with each other, and then the uncured material is cured, and a step of increasing a gap between the member and the substrate, after the uncured material is cured, wherein the driving profile for the alignment control after the alignment control is started and at least one of before and after the member contacts the uncured material is changed.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of copending U.S. patent applicationSer. No. 15/402,261, filed Jan. 10, 2017, published as U.S. PatentApplication Publication No. 2017/0115560 A1 on Apr. 27, 2017, which is adivisional of U.S. patent application Ser. No. 12/088,340, filed Mar.27, 2008, now U.S. Pat. No. 9,573,319, issued Feb. 21, 2017.

U.S. patent application Ser. No. 12/088,340 was a U.S. national stageapplication of International Application No. PCT/JP2008/052219, filedFeb. 5, 2008, which claims priority from Japanese Patent Application No.2007-027168, filed Feb. 6, 2007, and No. 2007-050545, filed Feb. 28,2007.

TECHNICAL FIELD

The present invention relates to an imprint apparatus in which alignmentcontrol of a mold and a substrate is effected, and a pattern formed onthe mold is transferred onto a pattern forming layer provided on thesubstrate.

BACKGROUND ART

In recent years, as described in, for example, Appl. Phys. Lett., Vol.67, Issue 21, pages 3114 to 3116 (1995) by Stephan Y. Chou, et al., afine processing technology for transferring a fine structure provided ona mold onto a member to be processed, such as a resin material, ametallic material, or the like, has been developed and has receivedattention. This technology is called nanoimprinting or nanoembossing,and provides a processing resolving power on the order of severalnanometers. For this reason, the technology is expected to be applied toa next-generation semiconductor manufacturing technology in place of alight exposure device, such as a stepper, a scanner, or the like.Further, the technology is capable of effecting simultaneous processingof a three-dimensional structure at a wafer level. For this reason, thetechnology has been proposed to be applied to a wide variety of fieldsin manufacturing technologies, and the like, for optical devices, suchas photonic crystals, and the like, biochips, such as a μ-TAS (micrototal analysis system), etc.

In such a pattern transfer technology using nanoimprinting, e.g., whenthe technology is used in the semiconductor manufacturing technology, orthe like, a minute (fine) structure at a mold surface is transferredonto a work (workpiece) in the following manner.

First, on a substrate (e.g., a semiconductor wafer), as the member to beprocessed constituting the work, a resin layer of a photocurable resinmaterial is formed. Next, a mold, on which a minute structure having adesired projection/recess pattern is formed, is aligned with the work onan ultraviolet (UV) curable resin material, is filled between the moldand the substrate, followed by irradiation with ultraviolet rays to curethe UV curable resin material. As a result, the minute structure of themold is transferred onto the resin layer. Then, etching, or the like,through the resin layer, as a mask, is effected to form the minutestructure of the mold on the substrate.

Incidentally, in semiconductor manufacturing, it is necessary to effect(positional) alignment of the mold with the substrate. For example, insuch a current circumstance that a semiconductor process rule is notmore than 100 nm, a tolerance of an alignment error due to an apparatusis said to be several nanometers to several tens of nanometers.

As such an alignment method, e.g., U.S. Pat. No. 6,696,220 has discloseda technique using different focal lengths with respect to two wavelengthlight beams, i.e., first and second light beams different in wavelength.In this technique, when a gap between a mold and a substrate has aspecific value, a mark provided at a mold surface is formed as an imageat a first wavelength on an image pickup device and a mark provided at asubstrate surface is formed as an image at a second wavelength, on thesame image pickup device. By observing the mold surface mark and thesubstrate surface mark, in-plane alignment between the mold and thesubstrate is effected.

Incidentally, with an increasing demand for high-definition fineprocessing these days, improvements in transfer accuracy and transferspeed by the above-described nanoimprinting are required.

The alignment method disclosed in U.S. Pat. No. 6,696,220, however, isnot always satisfactory for such a demand. That is, the alignment methodof U.S. Pat. No. 6,696,220 causes the following problem in the in-planealignment using the mark of the mold and the mark of the substrate.

In the pattern transfer using the nanoimprinting, different from atransfer (exposure) method using a conventional light exposure device,it is necessary to transfer the minute structure provided on the mold incontact with the work (the member to be processed), as described above.

In such a process that the transfer is performed, a contact interfacebetween the mold and the resin material can be placed in an unstablestate in a transition period during the contact of the mold with thephotocurable resin material of the work. Alternatively, before and afterthe mold and the photocurable resin material on the work contact eachother, various physical conditions with respect to measurement and drivefor the alignment can be changed.

The present inventors have come to a recognition that, with respect to acontrol condition limiting the alignment in the imprinting process, anoccurrence of an inconvenience may arise when the control condition isinvariant during a period from a non-contact state between the mold andthe resin material to a resin material curing process through a contactstage between the mold and the resin material. For example, a casewherein in-plane alignment of a mold with a substrate is performed byobserving a mold surface mark and a substrate surface mark isconsidered.

When alignment feedback control is effected under a control conditionfor the case of no error, although an error arises in a measurement unitobtained by the observation, an occurrence of a malfunction may arise asa result.

DISCLOSURE OF THE INVENTION

In view of the above-described problems, the present invention hasimproved a control condition with respect to alignment in an imprintingprocess.

Specific embodiments of the present invention will be described later,but an imprinting method according to a first aspect of the presentinvention is characterized in that feedback control is once stopped orinterrupted during alignment using feedback control. An imprintingmethod according to a second aspect of the present invention ischaracterized in that a control condition with respect to alignment ischanged during an imprinting process.

An imprinting method according to a first aspect of the presentinvention will be specifically described.

According to a first aspect, the present invention provides animprinting method for imprinting an imprinting pattern provided to amold onto a pattern forming layer formed on a substrate, the imprintingmethod comprising:

a first step of effecting alignment between the substrate and the moldwith feedback control;

a second step of bringing the mold and the pattern forming layer intocontact with each other;

a third step of curing the pattern forming layer; and

a fourth step of increasing a gap between the substrate and the mold,

wherein the imprinting method further comprises a step of stopping thefeedback control between the first step and the second step and/orbetween the second step and the third step.

The present invention provides imprinting methods, imprintingapparatuses, and an alignment method constituted as described below.

The present invention provides an imprinting method for imprinting apattern provided to a mold onto a resin material applied onto asubstrate by effecting alignment between the mold and the substrate withfeedback control, wherein the imprinting method comprises a step ofperforming feedback control, so that a malfunction of the feedbackcontrol, occurring during contact between the mold and the resinmaterial when the imprinting is performed, by bringing the mold and theresin material into contact with each other, is reduced or overcome.

In the imprinting method of the present invention, an operation in thestep of performing the feedback control may be a stopping operation ofthe feedback control when the contact between the mold and the resinmaterial is detected. The operation in the step of performing thefeedback control may also be a stopping operation of the feedbackcontrol when the mold and the resin material are placed in predeterminedpositions in front of the contact position therebetween.

In the imprinting method of the present invention, after the feedbackcontrol is stopped, the feedback control for alignment may be resumed.Further, after the feedback control is stopped and before the feedbackcontrol is resumed, adjustment of a gap between opposing surfaces of themold and the substrate may be performed.

In the imprinting method of the present invention, the operation in thestep of performing the feedback control may be a starting operation ofthe feedback control when the contact between the mold and the resinmaterial is detected. Further, the operation in the step of performingthe feedback control may be a feedback control operation performed bychanging an original control parameter in the feedback control when theresin material is brought into contact with the mold. The change in thecontrol parameter may be made after the feedback control is stopped whenthe contact between the mold and the resin material is detected. Thechange in the control parameter may be made when the contact between themold and the resin material is detected after the feedback control isstopped, when the mold and the resin material are placed inpredetermined positions in front of the contact position therebetween.

In the imprinting method of the present invention, adjustment of a gapbetween opposing surfaces of the mold and the substrate may be performedafter the feedback control is stopped and before the control parameteris changed.

In the imprinting method of the present invention, the control parametermay be any of a position measurement parameter for effecting alignmentwith respect to an in-plane direction, a distance measurement parameterfor effecting distance adjustment between the mold and the substrate,and a drive control parameter for performing an alignment operationbetween the mold and the substrate.

In the imprinting method of the present invention, the detection of thecontact between the mold and the resin material may be performed by achange in gradation of an observation image in the feedback control. Thedetection of the contact between the mold and the resin material may beperformed by a change in pressure exerted on the mold or the substratein the feedback control. Further, the detection of the contact betweenthe mold and the resin material may be performed by a change in ameasurement result of a distance between the mold and the substrate inthe feedback control.

In the present invention, an imprinting apparatus for imprinting apattern provided at a processing surface of a mold onto a resin materialapplied onto a substrate comprises a contact detection means fordetecting contact between the mold and the resin material and a processcontrol means for causing a position control means to effect alignmentbetween the mold and the substrate, so that a malfunction does not occurduring the contact between the mold and the resin material. The processcontrol means may be a control means for stopping the feedback controlwhen the contact between the mold and the resin material is detected bythe contact detection means. The process control means may be a controlmeans for stopping the feedback control when the mold and the resinmaterial are placed in predetermined positions in front of their contactposition. The process control means may be a control means for resumingthe feedback control for alignment after the feedback control isstopped. The process control means may be a control means forcontrolling a gap between opposing surfaces of the mold and thesubstrate after the feedback control is stopped and before the feedbackcontrol is resumed. The process control means may be a control means forstarting the feedback control when the contact between the mold and theresin material is detected by the contact detection means. The processcontrol means may be a control means for effecting the feedback controlby changing an original control parameter in the feedback control whenthe contact between the mold and the resin material is detected by thecontact detection means. The process control means may be a means foreffecting control so that the control parameter is changed when thecontact between the mold and the resin material is detected after thefeedback control is stopped when the mold and the resin material areplaced in predetermined positions in front of their contact position.The process control means may be a control means for resuming thefeedback control for alignment after the control parameter is changed.The process control means may be a control means for effecting controlof a gap between opposing surfaces of the mold and the substrate afterthe feedback control is stopped and before the control parameter ischanged.

In the present invention, an alignment method of two members includesoppositely disposing a first member and a second member contacting afluid material, effecting alignment between the first member and thesecond member with feedback control, and stopping the feedback controlor changing a control condition in the feedback control, by utilizinginformation about contact between the first member and the fluidmaterial.

According to a second aspect, the present invention provides animprinting method for transferring an imprinting pattern provided to amold onto a pattern forming layer interposed between the mold and asubstrate, the imprinting method comprising:

a detecting step of detecting states of the mold and the pattern forminglayer, during the transfer of the imprint pattern, by at least one of adisplacement of the mold or the substrate, a torque of a stage, and anamount of reflected light from the mold or the substrate; and

a changing step of changing at least one of a control method, a drivingprofile, and a control parameter of the stage on the basis of a detectedvalue in the detecting step.

The present invention provides imprinting apparatuses and imprintingmethods constituted as described below.

The present invention provides an imprinting apparatus for transferringa pattern of a mold onto a resin material interposed between the moldand substrate. The imprinting apparatus comprises a stage forpositioning one of the mold and the substrate with respect to the other,a control portion for controlling the stage, a detection means fordetecting states of the mold and the resin material in the patterntransfer by at least one of a load exerted on the mold or the substrate,a gap between the mold and the substrate, a displacement of the mold orthe substrate, a torque of the stage, and an amount of reflected lightfrom the mold or the substrate, and a means for changing at least one ofa stage control method, a stage drive profile, and a stage controlparameter on the basis of a detection value detected by the detectionmeans.

In the imprinting apparatus of the present invention, the detectionmeans may be a means for detecting states of the mold and the resinmaterial with a change in gap between the mold and the substrate orstages of the mold and the resin material with a change in gap betweenthe mold and the substrate until the gap is controlled at a constantlevel and is placed in a steady state.

In the imprinting apparatus of the present invention, the detectionvalue may include a change in differential coefficient and a change insecond-order differential coefficient. The change in differentialcoefficient or the change in second-order differential coefficient maybe a change in sign thereof. The detection means is capable of detectinga state due to an attraction force exerted between the mold and theresin material as the states of the mold and the resin material.

In the imprinting apparatus of the present invention, the control methodmay be either one or both of feedback control and feedforward control.The drive profile may include any of an acceleration, a speed, aposition, a driving voltage, and a driving current with respect to thestage. The control parameter may include any of a PID parameter, afeedfoward parameter, and a filter parameter.

The present invention provides an imprint apparatus in which alignmentcontrol of a mold and a substrate is effected, and a pattern formed onthe mold is transferred onto a pattern forming layer provided on thesubstrate. The imprint apparatus includes a mold holding portion forholding the mold, a substrate holding portion for holding the substrate,and a control portion for effecting control so that the mold held by themold holding portion and the substrate held by said substrate holdingportion are brought near to each other while effecting the alignmentcontrol, after the alignment control is started, to bring the mold andthe pattern forming layer into contact with each other and then thepattern forming layer is cured. The control portion changes a drivingprofile for the alignment control after the alignment control is startedand at least one of before and after the mold contacts the patternforming layer, wherein the driving profile (i) is a profile for movingat least one of the mold holding portion and the substrate holdingportion to a target position, and (ii) includes at least one of anacceleration, a speed, a driving voltage, and a driving current withrespect to at least one of the mold holding portion and the substrateholding portion.

The present invention provides an imprint apparatus in which alignmentcontrol of a mold and a substrate is effected, and a pattern formed onthe mold is transferred onto a pattern forming layer provided on thesubstrate. The imprint apparatus includes a mold holding portion forholding the mold, a substrate holding portion for holding the substrate,and a control portion for effecting control so that the mold held by themold holding portion and the substrate held by the substrate holdingportion are brought near to each other while effecting the alignmentcontrol to bring the mold and the pattern forming layer into contactwith each other, and the mold brought into contact with the patternforming layer and the substrate are brought further near to each other,and then the pattern forming layer is cured in a state in which the moldand the substrate are brought further near to each other. The controlportion changes, in a period from the time when the mold held by saidmold holding portion and the substrate held by the substrate holdingportion are brought near to each other until the time when the moldbrought into contact with the pattern forming layer and the substrateare brought further near to each other, a driving profile for thealignment control. The driving profile (i) is a profile for moving atleast one of the mold holding portion and the substrate holding portionto a target position, and (ii) includes at least one of an acceleration,a speed, a driving voltage, and a driving current with respect to atleast one of the mold holding portion and the substrate holding portion.

The present invention provides an imprint apparatus in which alignmentcontrol of a mold and substrate is effected, and a pattern formed on themold is transferred onto a pattern forming layer provided on thesubstrate. The imprint apparatus includes a mold holding portion forholding the mold, a substrate holding portion for holding the substrate,and a control portion for effecting control so that the mold held by themold holding portion and the substrate held by the substrate holdingportion are brought near to each other while effecting the alignmentcontrol, after the alignment control is started, to bring the mold andthe pattern forming layer into contact with each other, and then thepattern forming layer is cured. The control portion changes a controlparameter for the alignment control after the alignment control isstarted and at least one of before and after the mold contacts thepattern forming layer, wherein the control parameter (i) is a parameterfor moving at least one of the mold holding portion and the substrateholding portion to a target position, and (ii) includes at least one ofa PID parameter, a feedforward parameter, and a filter parameter.

The present invention provides an imprint apparatus in which alignmentcontrol of a mold and a substrate is effected, and a pattern formed onthe mold is transferred onto a pattern forming layer provided on thesubstrate. The imprint apparatus includes a mold holding portion forholding the mold, a substrate holding portion for holding the substrate,and a control portion for effecting control so that the mold held by themold holding portion and the substrate held by the holding portion arebrought near to each other while effecting the alignment control tobring the mold and the pattern forming layer into contact with eachother, and the mold brought into contact with the pattern forming layerand the substrate are brought further near to each other and then thepattern forming layer is cured in a state in which the mold and thesubstrate are brought further near to each other. The control portionchanges, in a period from the time when the mold held by the moldholding portion and the substrate held by the substrate holding portionare brought near to each other until the time when the mold brought intocontact with the pattern forming layer and the substrate are broughtfurther near to each other, a control parameter for the alignmentcontrol. The control parameter (i) is a parameter for moving at leastone of a mold holding portion for holding the mold and a substrateholding portion for holding the substrate to a target position, and (ii)includes at least one of a PID parameter, a feedforward parameter, and afilter parameter.

The present invention provides an imprint apparatus in which alignmentcontrol of a mold and a substrate is effected, and a pattern formed onthe mold is transferred onto a pattern forming layer provided on thesubstrate. The imprint apparatus includes a mold holding portion forholding the mold, a substrate holding portion for holding the substrate,and a control portion for effecting control so that the mold held by themold holding portion and the substrate held by the substrate holdingportion are brought near to each other while effecting the alignmentcontrol, after the alignment control is started, to bring the mold andthe pattern forming layer into contact with each other and then thepattern forming layer is cured. The control portion changes a controlparameter for the alignment control after the alignment control isstarted and at least one of before and after the mold contacts thepattern forming layer, wherein the control parameter (i) is a parameterfor moving at least one of the mold holding portion and the substrateholding portion to a target position, and (ii) includes a proportionalgain.

The present invention provides an imprint apparatus in which alignmentcontrol of a mold and a substrate is effected, and a pattern formed onthe mold is transferred onto a pattern forming layer provided on thesubstrate. The imprint apparatus includes a mold holding portion forholding the mold, a substrate holding portion for holding the substrate,and a control portion for effecting control so that the mold held by themold holding portion and the substrate held by the substrate holdingportion are brought near to each other while effecting the alignmentcontrol to bring the mold and the pattern forming layer into contactwith each other, and the mold brought into contact with the patternforming layer and the substrate are brought further near to each otherand then the pattern forming layer is cured in a state in which the moldand the substrate are brought further near to each other. The controlportion changes, in a period from the time when the mold held by themold holding portion and the substrate held by the substrate holdingportion are brought near to each other until the time when the moldbrought into contact with the pattern forming layer and the substrateare brought further near to each other, a control parameter for thealignment control. The control parameter (i) is a parameter for movingat least one of the mold holding portion and the substrate holdingportion to a target position, and (ii) includes a proportional gain.

The present invention also provides an imprinting method fortransferring a pattern of a mold onto a resin material interposedbetween the mold and a substrate. The imprinting method comprises adetecting step of detecting stages of the mold and the resin material inthe pattern transfer by at least one of a load exerted on the mold orthe substrate, a gap between the mold and the substrate, a displacementof the mold or the substrate, a torque of a stage, and an amount ofreflected light from the mold or the substrate, and a changing step ofchanging at least one of a stage control method, a stage drive profile,and a control parameter on the basis of a detection value detected inthe detecting step.

In the imprinting method of the present invention, the detection valuemay include a change in differential coefficient and a change insecond-order differential coefficient. The change in differentialcoefficient or the change in second-order differential coefficient maybe a change in sign thereof. The detection states of the mold and theresin material result from an attraction force exerted between the moldthe resin material.

In the imprinting method of the present invention, at least one of thecontrol method, the drive profile, and the control parameter may bechanged before and/or after the mold and the resin material is cured. Inthe imprinting method, with respect to each of axes in an in-planedirection of the mold, either one or both of different control methodsand different control parameters may be changed.

The present invention provides an imprinting method comprising a gapdecreasing step of decreasing a gap between a mold and a substrate in astate in which a resin material is interposed between the mold and thesubstrate, and a step of curing the resin material and transferring apattern provided to the mold onto the resin material after the gapdecreasing step. In the gap decreasing step, while detecting a loadincluding a pressure exerted between the mold and the substrate on atime base, a control condition concerning movement of the mold and thesubstrate in a direction perpendicular to their opposing surfaces ischanged between a state in which the load is increased with thedecreasing gap and a stage in which the load is decreased with thedecreasing gap.

According to the present invention, it is possible to effect alignmentcontrol more suitable for an imprinting process.

These and other objects, features, and advantages of the presentinvention will become more apparent upon a consideration of thefollowing description of the preferred embodiments of the presentinvention taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flow chart illustrating an imprinting process according tothe present invention.

FIG. 2 is a schematic diagram illustrating a constitution of animprinting apparatus in Embodiment 1-1 of the present invention.

FIG. 3 is a flow chart illustrating a feedback control operationsequence in Embodiment 1-1 of the present invention.

FIG. 4 is a flow chart illustrating a step of performing a feedbackcontrol operation in a pattern transfer step by imprinting in Embodiment1-1 of the present invention.

FIGS. 5(a), 5(b), 6, and 7 are graphs each illustrating detection ofcontact (liquid contact) between a mold and a resin material inEmbodiment 1-1 of the present invention.

FIGS. 8 and 9 are flow charts each illustrating a step of performing afeedback control operation in a pattern transfer step by imprinting inEmbodiment 1-2 (FIG. 8) or Embodiment 1-3 (FIG. 9) of the presentinvention.

FIGS. 10(a) and 10(b) are schematic views illustrating an example ofdetection of contact between a mold and a resin material in Embodiment1-3 of the present invention.

FIGS. 11(a) and 11(b) are graphs each illustrating a change inmeasurement/drive parameter in Embodiment 1-3 of the present invention.

FIG. 12 is a flow chart illustrating a step of performing a feedbackcontrol operation in a pattern transfer step by imprinting in Embodiment1-4 of the present invention.

FIG. 13 is a flow chart illustrating a step of effecting imprinting withrespect to a chip in Embodiment 2-1 of the present invention.

FIGS. 14(a), 14(b), and 14(c) are schematic diagrams illustratingcontrol of a stage in Embodiment 2-1 of the present invention, whereinFIG. 14(a) is a control block diagram, FIG. 14(b) is a diagram forillustrating a PI control mechanism, and FIG. 14(c) is a diagram showinga time chart.

FIG. 15 is a schematic view illustrating a constitution of an imprintingapparatus in Embodiment 2-1 of the present invention.

FIGS. 16(a) and 16(b) are schematic diagrams illustrating a problem tobe solved by the present invention, wherein FIG. 16(a) is a controlblock diagram and FIG. 16(b) is a time chart.

FIG. 17 is a perspective view showing a mold in Embodiment 2-2 of thepresent invention.

FIG. 18 is a flow chart illustrating steps for effecting imprinting withrespect to a chip in Embodiment 2-2 of the present invention.

FIG. 19 is a time chart illustrating a state of the imprinting inEmbodiment 2-2 of the present invention.

FIGS. 20(a), 20(b), and 20(c) are schematic diagrams illustratingcontrol of a stage in Embodiment 2-3 of the present invention, whereinFIG. 20(a) is a control block diagram, FIG. 20(b) is a diagram forillustrating a PI control mechanism, and FIG. 20(c) is a time chart.

BEST MODE FOR CARRYING OUT THE INVENTION

The present invention provides an imprinting method and an imprintingapparatus for imprinting a pattern provided to a mold onto a patternforming layer (imprint material) formed on a substrate.

Specifically, the imprinting method includes the following first tofourth steps:

first step: alignment between the substrate and the mold is effectedwhile effecting alignment control,

second step: the mold and the pattern forming layer are brought intocontact with each other,

third step: the pattern forming layer is cured, and

fourth step: a gap between the substrate and the mold is increased.

In the second step, the contact between the mold and the pattern forminglayer means not only direct contact between the mold and the patternforming layer, but also, indirect contact therebetween through a releaselayer. In the latter case, the release layer can be inclusively regardedas the mold.

In the third step, the curing of the pattern forming layer may beperformed by using light, such as ultraviolet rays, or using heat.

The operation performed in the fourth step is a so-called releasingoperation.

In the present invention, in order to prevent a malfunction of thealignment control occurring during the contact between the mold and thesubstrate, the imprinting method further includes another step.

Specifically, between the first step and the second step and/or betweenthe second step and the third step, the imprinting method includes thefollowing step (A) or (B):

(A) a step of stopping the feedback control, or

(B) a step of changing at least one of a control method, a driveprofile, and a control parameter of a stage for effecting the alignmentcontrol.

Hereafter, two embodiments including the step (A) and the step (B) asfeatures thereof, respectively, will be described as a First Embodimentand a Second Embodiment.

First Embodiment: Imprinting Process (Method) and Imprinting ApparatusIncluding Feedback Control Step

In an imprinting method of this embodiment, an imprinting patternprovided to a mold is imprinted on a pattern forming layer formed on asubstrate.

Specifically, as shown in FIG. 1, the imprinting method includes thefollowing first to fourth steps (S1) to (S4):

(S1) first step: alignment between the substrate and the mold iseffected while effecting feedback control,

(S2) second step: the mold and the pattern forming layer are broughtinto contact with each other,

(S3) third step: the pattern forming layer is cured, and

(S4) fourth step: a gap between the substrate and the mold is increased.

In the imprinting method, between the first step and the second stepand/or between the second step and the third step, the feedback controlis stopped.

In the case wherein the feedback control is stopped between the firststep and the second step, after the feedback control is stopped, themold and the pattern forming layer contact each other. Accordingly, inthe case wherein an error in position measurement information occursduring the contact between the mold and the pattern forming layer, thefeedback control is not carried out, so that it is possible to prevent amalfunction with respect to an alignment control operation.Incidentally, the feedback control and an imprinting apparatus forperforming the imprinting process will be specifically described laterwith reference to FIG. 3 and FIG. 2, respectively.

In a state in which the feedback control is stopped after the alignmentbetween the substrate and the mold is effected in the first stepdescribed above, the second step is performed and, thereafter, thealignment between the substrate and the mold can be effected with thefeedback control (as specifically described later with reference to FIG.8).

Further, in a state in which the feedback control is stopped after thealignment is effected in the first step, the second step is performedand, thereafter, it is also possible to perform the alignment of thesubstrate and the mold with feedback control on the basis of a controlparameter different from that of the feedback control in the first step(as specifically described later with reference to FIG. 12).

Incidentally, after positional control, such as the feedback control, isonce stopped, it is also possible to effect control on the basis of ameasurement parameter different from that of the feedback control in thefirst step, in place of the control parameter different from that of thefeedback control in the first step. The measurement parameter mayinclude a refractive index for calculating a distance and a threshold ofa gradation (level) value for detecting a position.

In a case wherein the feedback control is stopped between the secondstep and the third step, it is possible to prevent the malfunction,similarly, as in the above-described case, e.g., by stopping thefeedback control immediately after the detection of the contact betweenthe mold and the pattern forming layer.

In a state in which the feedback control is stopped after the mold andthe pattern forming layer are brought into contact with each other inthe second step, the gap between the substrate and the mold is decreasedand, thereafter, it is possible to effect alignment between thesubstrate and the mold with feedback control (as specifically describedlater with reference to FIG. 4).

Further, in a state in which the feedback control is stopped after themold and the pattern forming layer are brought into contact with eachother in the second step, the gap between the substrate and the mold isdecreased and, thereafter, it is also possible to effect alignmentbetween the substrate and the mold with feedback control on the basis ofa control parameter different from that of the feedback control in thefirst step (as specifically described later with reference to FIG. 9).

Herein, the term “feedback control” means control with respect toso-called alignment for determining a relative positional relationshipbetween the mold and the substrate. Further, the term “alignment” meanspositional adjustment with respect to a positional relationship betweenthe mold and the substrate in an in-plane direction or positionaladjustment with respect to a gap between the mold and the substrate.With respect to these alignments (positional adjustments), it ispossible to effect the feedback control.

In this embodiment, in place of the feedback control, it is alsopossible to employ another alignment control, such as feedforwardcontrol.

In the above-described second step, it is possible to appropriatelydetect the contact between the mold and the pattern forming layer.

The substrate may include, e.g., quartz, glass, a silicon wafer, and thelike, but it is not particularly limited. The pattern forming layer may,e.g., comprise a photocurable resin material. The present inventionprovides a process suitable for a so-called photoimprinting, but mayalso be applicable to thermal imprinting using a thermoplastic resinmaterial.

The mold is provided with an imprinting pattern having aprojection/recess structure. The mold is, e.g., formed of quartz. Insome cases, on the surface of the mold, a layer of fluorine-containingresin material as a release agent is applied. In the present invention,in a case wherein such a release agent is used, the release agent isinclusively regarded as being the mold. Accordingly, the second stepincludes not only the case of direct contact between the mold and thepattern forming layer, but also, the case of contact therebetweenthrough the release agent.

The curing of the pattern forming layer in the third step is performedby, e.g., ultraviolet irradiation, or the like. Also, during the curingof the pattern forming layer, it is preferable that the position controlbetween the mold and the substrate is effected (in this case, theposition control is not limited to the feedback control, but may also beeither one or both of in-plane position control and gap control).

In the fourth step, the cured pattern forming layer and the mold areseparated from each other by increasing the gap between the substrateand the mold. In the fourth step, it is possible to appropriatelydetermine an object to be moved from either one or both of the substrateand the mold.

The present invention is also applicable to a method for forming animprinting pattern on an entire large-size substrate by performing aplurality of imprinting process operations with a mold smaller than thesubstrate (step-and-repeat method).

An imprinting apparatus in this embodiment includes, as a means forexecuting the above-described imprinting process, the followingportions:

a mold holding portion for holding a mold;

a substrate holding portion for holding a substrate;

a position control portion for controlling a positional relationship,with feedback control, between held by the mold holding portion and thesubstrate held by the substrate holding portion; and

a contact detecting portion for detecting contact between a patternforming layer on the substrate and the mold.

In the imprinting apparatus of this embodiment, after the feedbackcontrol by the position control portion is stopped, the mold holdingportion and the substrate holding portion are relatively moved so as tobring the pattern forming layer and the mold into contact with eachother. Alternatively, after the control between the pattern forminglayer and the mold is detected by the contact detection portion, thefeedback control is stopped.

By using the above-described imprinting method, it is possible toprovide a member having a desired pattern shape. Specifically, asubstrate subjected to the above-described imprinting process isprepared and subjected to etching through, as a mask, a pattern forminglayer onto which the imprinting pattern described above is transferred.In this way, the substrate is processed to obtain a member having thedesired pattern shape. Examples of the member may include a biochipprovided with minute flow passages and a semiconductor chip.

In this embodiment, it is also possible to know information about thecontact by an operation time of the imprinting apparatus withoutproviding the above-described contact detecting portion. For example,information about a distance between the mold and the substrate, athickness of the resin material (pattern forming layer), and a gapbetween the mold and the substrate is collected at the time of startingthe imprinting operation. When a speed during an increase in gap can beknown, it is possible to know whether or not the mold contacts the resinmaterial at a certain time.

Accordingly, the imprinting apparatus can also be constituted byincluding the mold holding portion, the substrate holding portion andthe position control portion, wherein the mold holding portion and thesubstrate holding portion are relatively moved, so that the patternforming layer and the mold contact each other after the feedback controlby the position control is stopped, or wherein the position control isstopped after the pattern forming layer and the mold contact each other.

Second Embodiment

An imprinting method of this embodiment will be described below.

First, a problem arising during alignment between the mold and thesubstrate will be described.

FIGS. 16(a) and 16(b) are schematic diagrams for illustrating animprinting state.

FIG. 16(a) is a block diagram. As shown in FIG. 16(a), a signal from aprofiler is inputted into a control mechanism and an output from thecontrol mechanism is inputted into an object to be controlled. FIG.16(b) is a time chart, wherein a z-position profile, during imprinting,in which the substrate is brought near to the mold and the resinmaterial contacts the mold and is UV-cured and released from the mold,is shown. A point z=0 is a position at which the mold and the substratecompletely contact each other. Because of the presence of the resinmaterial, in this profile, the movement is stopped at a position where zis, e.g., 100 nm. In FIG. 16(b), (1) is an area in which the mold andthe resin material on the substrate do not contact each other; (2) to(5) are areas in which the mold and the (liquid) resin material contacteach other; (6) is an area in which the resin material is cured by UVirradiation; (7) is an area in which the mold is separated from theresin material; and (8) is an area in which the mold is retracted fromthe contact position.

Herein, for reference, a load exerted on the mold during a conventionalimprinting process is taken as load 1. In this case, the resin materialhas a high viscosity, so that a repulsive force is exerted depending ona z-position from the area (2) in which the mold contacts the resinmaterial. A control parameter of a stage is constant at a proportionalcomponent Kp. However, in semiconductor manufacturing processing thesedays, a process rule is small, so that a gap between the mold andsubstrate is decreased to several tens of nanometers. For this reason,such an attempt to utilize a low-viscosity resin material to lower apressing force has been made.

In these circumstances, when the load is measured in detail, it has beenfound that a phenomenon such as a load 2 is caused to occur.

Specifically, when the load in the state in which the mold contacts theresin material, there arise the three cases (1), (2) and (3):

(1) the case in which the load is not so changed even when the mold andthe resin material contact each other,

(2) the case in which a repulsive force is exerted between the mold andthe substrate, and

(3) the case in which an attractive force is exerted between the moldand the substrate.

The load is not changed with not only the change in gap between the moldand the substrate, but also, a time until the gap is controlled at aconstant level to be placed in a steady state. The load is changeddepending on not only a component, a viscosity, a thickness, a density,a contact area, and the like, with respect to the resin material, butalso, a surface state of the mold, a pattern shape, and the like. Forthis reason, in the case wherein the mold and the substrate arecontrolled by the same control parameter, an increase in positionalerror and an increase in setting time are caused to occur. Further, thecontrol is unstable in some cases, and the pattern of the mold or thesubstrate can be broken occasionally.

In this embodiment, in view of the above-described problems, imprintingapparatuses and methods are provided that are capable of improving theaccuracy of alignment between the mold and the substrate by changing atleast one of control conditions concerning the mold and the substrate,depending on states of the mold and the resin material, which varydepending on the change in gap between the mold and the substrate in thepattern transfer.

More specifically, by changing at least one of control conditions, suchas a stage control method, a stage drive profile, and a stage controlparameter, depending on the state of the resin material interposedbetween the mold and the substrate, adverse effects due to the change inload exerted between the mold and the substrate are obviated.

For this reason, in this embodiment, the imprinting method and theimprinting apparatus can be constituted specifically as follows.

In the second embodiment, an imprinting method for transferring animprinting pattern provided to a mold onto a pattern forming layerinterposed between the mold and a substrate is characterized byincluding a detecting step of detecting states of the mold and adetecting step of detecting states of the mold and the pattern forminglayer during the imprinting pattern transfer by at least one of a loadexerted on the mold or the substrate, a gap between the mold and thesubstrate, a displacement of the mold or the substrate, a torque of thestage, and an amount of reflected light from the mold or the substrate,and a step of changing at least one of a stage control method, a stagedrive profile and a stage control parameter on the basis of a detectionvalue detected in the detecting step.

It is also possible to add, to the above steps, the following steps:

a position control step for performing control of alignment between themold and the substrate,

a contact step for bringing the mold and the pattern forming layer intocontact with each other,

a curing step for curing the pattern forming layer,

a step of increasing the gap between the mold and the substrate, and

a step of stopping the alignment control in the position control stepbetween the position control step and the contact step and/or betweenthe contact step and the curing step.

An imprinting apparatus for carrying out the above-described imprintingmethod is used for transferring a pattern of the mold onto the resinmaterial interposed between the mold and the substrate and includes:

a stage for positioning one of the mold and the substrate with respectto each other,

a control portion for controlling the stage,

a detecting means for detecting states of the mold and the resinmaterial by at least one of a load exerted on the mold or the substrate,a gap between the mold and the substrate, a displacement of the mold orthe substrate, a torque of the stage, and an amount of reflected lightfrom the mold or the substrate, and

a means for changing at least one of a stage control method, a stagedrive profile, and a stage control parameter on the basis of a detectionvalue detected by the detecting means.

As the control method, it is possible to employ either one or both ofthe feedback control and forward control.

By the above-described constitution, depending on the states of the moldand the resin material, particularly, depending on a state of the resinmaterial varying due to a change, in load exerted between the mold andthe substrate, from the repulsive force to the attractive force, bychanging at least one of the control conditions described above, theabove-described adverse effects are obviated.

Further, in this embodiment, the imprinting method can be specificallyconstituted as follows.

The states of the mold and the resin material in the pattern transferare detected by at least one of the load exerted on the mold or thesubstrate, the gap between the mold and the substrate, the displacementof the mold or the substrate, the stage torque, and the amount ofreflected light from the mold or the substrate. In this case, it ispossible to employ a constitution in which states of the mold and theresin material, with a change in gap between the mold and the substrate,or states of the mold and the resin material with such a change, thatthe gap between the mold and the substrate is controlled at a constantlevel until the gap is placed in steady state, are detected. Then, onthe basis of a detected value, at least one of the stage control method,the stage drive profile, and the stage control parameter is changed.

Further, by the above-described constitution, depending on the states ofthe mold and the resin material, particularly, depending on a state ofthe resin material varying due to a change, in a load exerted betweenthe mold and the substrate, from the repulsive force to the attractiveforce, by changing at least one of the control conditions describedabove, the above-described adverse effects are obviated.

The imprinting method of this embodiment is constituted by including astep of decreasing the gap between the mold and the substrate in a statein which the resin material is interposed between the mold and thesubstrate, and a step of curing the resin material and transferring thepattern provided to the mold onto the resin material after the step ofdecreasing the gap. Further, in the gap decreasing step, while detectinga load including a pressure exerted between the mold and the substrateon a time basis, a control condition, concerning movement of the moldand the substrate in a direction perpendicular to opposing surfaces ofthe mold and the substrate, is changed between a state in which the loadis increased with the decreasing gap and a state in which the load isdecreased with the decreasing gap.

By the constitution described above, an occurrence of breakage, or thelike, due to contact between the mold and the substrate at the instantat which the load exerted between the mold and the substrate, is changedfrom the repulsive force to the attractive force, while the gap betweenthe mold and the substrate is decreased, is obviated.

Hereafter, embodiments of the present invention will be describedspecifically.

Embodiment 1-1

An imprinting apparatus and an imprinting method according to thepresent invention will be described.

FIG. 2 is a schematic view for illustrating a constitution of theimprinting apparatus of this embodiment.

Referring to FIG. 2, the imprinting apparatus includes a casing 101, astage 102, a substrate holding portion 103, a substrate 104, aphotocurable resin material 105, a mold 106 having a pattern at itsprocessing surface, a mold holding portion 107, a load cell 108, scopes109 and 110, a UV light source 111, a dispenser 112, a process controlcircuit (means) 113, an application control circuit 114, a positiondetection circuit (means) 115, an exposure amount control circuit 116, apressure detection circuit 117, and a position control circuit (means)118.

As shown in FIG. 2, in the imprinting apparatus of this embodiment, themold 106 and the substrate 104, are disposed opposite to each other.

The mold 106 is a transparent member having a desired projection/recess(uneven) pattern at its surface facing the substrate 104 and isconnected to the casing 101 through the mold holding portion 107, theload cell 108, and a member. A material for the mold 106 can beappropriately selected from transparent materials such as quartz,sapphire, TiO₂, SiN, and the like. At the substrate-side surface of themold 106, a releasing treatment using a fluorine-containing silanecoupling agent, or the like, may generally be performed.

The scope 109 is constituted by a light source, a lens system and animage-pickup device, and obtains information between the mold 106 andthe substrate 104 as an image. The scope 110 is constituted by a lightsource, a lens system and an image-pickup device, and obtains aninterference spectrum obtained from a gap between the opposing surfacesof the mold 106 and the substrate 104.

The UV light source 11 is provided at a portion of the casing 101 facingthe back-side surface of the mold 106.

The substrate 104 is mounted on the stage 102 through the substrateholding portion 103.

The stage 102 has six movable directions with respect to six axes (x, y,z, 0, a, (3), and is secured to the casing 101.

The dispenser 112 is attached to the casing 101 through a member, sothat the photocurable resin material 105 can be applied onto thesubstrate at any position.

The process control circuit (means) 113 provides instructions to theapplication control circuit 114, the position detection circuit (means)115, the exposure amount control circuit 116, the pressure detectioncircuit 117, and the position control circuit (means) 118, to carry outthe imprinting process. Further, at the same time, the process controlcircuit 113 receives output data from these circuits to control theentire process.

The application control circuit 114 controls the dispenser 112 so as toapply the photocurable resin material 105 onto the substrate 104.

The position detection circuit 115 performs image processing of theimage obtained by the scope 109 and analysis of a waveform obtained bythe scope 110 to determine an in-plane positional relationship and thegap between the mold 106 and the substrate 104 with respect to ahorizontal direction (XY direction) of a transfer surface.

The exposure amount control circuit 116 controls the UV light source 111to perform light exposure.

The pressure detection circuit 117 calculates a pressure exerted betweenthe mold 106 and the substrate 104 from a detection signal by the loadcell 108 and an area of a portion to be processed.

The position control circuit controls the stage 102 so that the mold 106and the substrate 104 can satisfy a desired positional relationship.

Incidentally, arrangements and methods of the respective mechanisms(means) are not limited to those in this embodiment, but may alsoinclude other constitutions, such as a constitution in which the mold106 is moved instead of the substrate 104.

A pattern transfer step by imprinting in this embodiment will bedescribed.

First, onto the substrate 104, the photocurable resin material 105 isapplied by the dispenser 112 to be formed in a pattern forming layer.

Next, the mold 106 and the substrate 104 onto which the photocurableresin material 105 is applied are disposed opposite to each other and ina gap therebetween, the resin material is extended and filled while thepositional relationship between the mold 106 and the substrate 104 isadjusted by using the scopes 109 and 110. In this state, a pressureexerted between the mold 106 and the substrate 104 is detected by thepressure detection circuit 117.

Next, the resin material between the substrate 104 and the mold 106 isirradiated with UV light emitted from the UV light source 111 to becured.

Finally, the substrate 104 and the mold 106 are separated from eachother to release the cured resin material from the mold 106.

Through the above steps, the surface projection/recess pattern of themold 106 as an imprinting pattern is transferred onto the resin materiallayer on the substrate 104.

An alignment step and the pattern transfer step between the mold 106 andthe substrate 104 will be described in detail.

The alignment between the mold 106 and the substrate 104 is performed byobserving an alignment mark on the mold 106 and an alignment mark on thesubstrate 104 through the scope 109. The position detection circuit 115performs image processing for detecting positions of the alignment marksby providing a threshold value to gradation (level) values of the imageobtained by the scope 109, to detect an in-plane positional relationshipbetween the mold 106 and the substrate 104.

Measurement of the gap between the mold 106 and the substrate 104 iseffected by observing interference of broad-band light emitted from thescope 110 between the mold 106 and the substrate 104. Examples of thelight source for emitting the broad-band light may include a halogenlight source, a xenon light source, and the like. In the positiondetection circuit 115, the gap is calculated from a spatial refractiveindex, or the like, between the mold 106 and the substrate 104, by usingthe interference wave obtained by the scope 110. In the presentinvention, the gap measuring method between the mold 106 and thesubstrate 104 is not limited to this method. For example, in place ofthe broad-band light source, it is also possible to use a narrow-bandlight source, such as a laser, an LED, or the like.

FIG. 3 is a diagram for illustrating a feedback control operationsequence in the alignment step.

In a step S1-1, alignment feedback control is started.

In a step S1-2, a positional relationship between the mold 106 and thesubstrate 104 is measured.

Next, in a step S1-3, a difference between a measured value and a targetvalue is judged as to whether or not it is within a reference value.

When the difference is not within the reference value, substratepositional control in a step S1-4 is effected. Thereafter, themeasurement in the step S1-2 is performed again.

When the difference is within the reference value, the alignmentfeedback control is completed in a step S1-5. This feedback control isapplicable to either one or both of in-plane alignment between the moldand the substrate and alignment concerning the gap between the mold andthe substrate.

FIG. 4 is a flow chart for illustrating steps for effecting feedbackcontrol in the pattern transfer process for imprinting (transferring)the pattern provided to the mold onto the resin material applied ontothe substrate.

In a step S2-1, the pattern transfer process is started. In this state,the photocurable resin material 105 is applied onto the substrate 104and the mold 106 does not contact the (liquid) resin material 105.

In a step S2-2, alignment feedback control is started.

Next, in a step S2-3, the contact of the mold 106 with the resinmaterial 105 is detected and, then, in a step S2-4, the alignmentfeedback control is stopped.

After the alignment feedback control is stopped, in a step S2-5, thestage 102 is driven to bring the mold 106 and the substrate 104 close toeach other by a certain distance to effect adjustment of a gap betweenthe opposing surfaces of the mold 106 and the substrate 104.

After the photocurable resin material 105 contacts the mold 106 andcompletes a fluid state (control transition state), in a step S2-6, thealignment feedback control is resumed. After the alignment feedbackcontrol is completed, in a step S2-7, the photocurable resin material105 is cured by UV light irradiation from the UV light source.

In a step S2-8, the mold 106 is released from the cured resin material105 and then, in a step S2-9, the pattern transfer process is completed.

By these steps, the alignment feedback control can be effected so that amalfunction of the feedback control occurring during the contact betweenthe mold 106 and the substrate 104 can be reduced, thus ensuring theimprinting.

When the mold 106 satisfies the accuracy required for positionaldeviation due to the contact between the mold 106 and the photocurableresin material 10, it is also possible to employ such a step that thephotocurable resin material 105 is cured without effecting the alignmentfeedback control after the contact.

In some cases, a refractive index is changed by changing a substance(resin material) between the substrate 104 and the mold 106 to anothersubstance, so that accurate gap measurement cannot be performed beforeand after the contact, thus resulting in difficulty of effecting theaccurate feedback control. However, it is possible to obviate thedifficulty by effecting the alignment feedback control for the gap onlyafter the contact.

FIGS. 5(a) and 5(b) are graphs illustrating a method of detecting thecontact between the mold 106 and the photocurable resin material 105.

FIG. 5(a) is a graph showing gradation values (levels) in a certain areaof the image obtained by a scope 109 in the position detection circuit115. In this case, the gradation value is G₁.

FIG. 5(b) is a graph showing a change of the gradation value of G₁ withtime. A reflectance is changed when the mold 106 contacts thephotocurable resin material 105, so that the gradation value isnon-continuously changed from G₁ to G₂, as shown in FIG. 5(b).

Accordingly, at a time T₁ at which the gradation value isnon-continuously changed, a judgment that the mold 106 and thephotocurable resin material 105 contact each other is made.

As described above, by using the change in gradation value with time, itis possible to constitute the contact detection means.

Next, another constitution of the contact detection means for detectingthe contact between the mold 106 and the photocurable resin material 105will be described.

FIG. 6 is a graph showing a change with time of a measurement result ofa gap (distance) between the mold 106 and the substrate 104 before andafter the mold 106 and the photocurable resin material 105 contact eachother. At a time T₂ shown in FIG. 6, the gap value is non-continuouslychanged. This is because a refractive index in an optical path of lightused for measurement is changed from that of air to that of thephotocurable resin material 105 by the contact of the mold 106 with thephotocurable resin material 105. Although an actual refractive index isnot changed, the gap measurement value is non-continuously changed whenthe mold 106 and the photocurable resin material 105 contact each other.Therefore, a judgment that the mold 106 and the photocurable resinmaterial 105 contact each other, at the time 12 at which the gap valueis non-continuously changed, is made.

Another constitution of the contact detection means for detecting thecontact between the mold 106 and the photocurable resin material 105will be described.

FIG. 7 is a graph showing a change with time of a pressure exertedbetween the mold 106 and the substrate 104 measured by the pressuredetection circuit 117. As shown in FIG. 7, at a time T₃, a pressurewhich is constant until a measurement time reaches the time T₂ ischanged. This is because the mold 106 contacts the photocurable resinmaterial 105. Therefore, a judgment that the mold 106 and thephotocurable resin material 105 contact each other, at the time T₃ atwhich the pressure is changed, is made.

In the present invention, even in constitutions other than theabove-described three constitutions of the contact detection means, itis possible to apply means or methods capable of detecting the contactbetween the mold 106 and the photocurable resin material 106.

In this embodiment, in the alignment between the mold and the substrate104, the feedback control for the alignment is stopped simultaneouslywith the detection of the contact between the mold 106 and thephotocurable resin material 105.

By this operation, it is possible to reduce an occurrence of amalfunction of an alignment operation in a transition period during thecontact between the mold 106 and the substrate 104. As a result, it ispossible to perform high-speed processing capable of reducing breakageof the mold and the substrate.

The apparatus constitution as to the alignment between the mold 106 andthe substrate 104 is not limited to that in this embodiment, but othermethods capable of the alignment between the mold 106 and the substrate104 may also be applicable.

Embodiment 1-2

Next, an imprinting method and an imprinting apparatus in thisembodiment will be described.

A difference between this embodiment and Embodiment 1-1 is only anoperation sequence in the pattern transfer process, so that only thepattern transfer process will be described.

FIG. 8 is a flow chart illustrating steps for effecting feedback controlin the pattern transfer process for imprinting the pattern provided tothe mold.

In a step S3-1, the pattern transfer process is started. In this state,the photocurable resin material 105 is applied onto the substrate 104and the mold 106 does not contact the (liquid) resin material 105.

In a step S3-2, alignment feedback control is started.

Next, in a step S3-3, the feedback control is stopped when the mold 106and the photocurable resin material 105 applied onto the substrate 104are placed at predetermined positions in front of a contact positiontherebetween.

After the feedback control is stopped, in a step S3-4, the stage 102 isdriven to bring the mold 106 and the substrate 104 close to each otherto effect gap adjustment (gap control) between the opposing surfaces ofthe mold 106 and the substrate 104. That is, before the alignmentfeedback control is resumed in a step S3-6, performed later, the gapadjustment (gap control) is effected.

Next, in a step S3-5, the contact of the mold 106 with the resinmaterial 105 is detected, and then, in step S3-6, the alignment feedbackcontrol is resumed.

After the alignment feedback control is completed, in a step S3-7, thephotocurable resin material 105 is cured by UV light irradiation fromthe UV light source.

In a step S3-8, the mold 106 is released from the cured resin material105 and then, in a step S3-9, the pattern transfer process is completed.

In this embodiment, in the alignment between the mold and the substrate104, the feedback control for the alignment is stopped in advance duringthe contact between the mold 106 and the photocurable resin material105. Then, the feedback control is resumed after detection of thecontact.

By this operation, it is possible to reduce an occurrence of amalfunction of an alignment operation during the contact between themold 106 and the substrate 104. As a result, it is possible to performhigh-speed processing capable of reducing breakage of the mold and thesubstrate.

Embodiment 1-3

Next, an imprinting method and an imprinting apparatus in thisembodiment will be described.

A difference between this embodiment and Embodiment 1-1 is only anoperation sequence in the pattern transfer process, so that only thepattern transfer process will be described.

FIG. 9 is a flow chart illustrating steps for effecting feedback controlin the pattern transfer process for imprinting the pattern provided tothe mold.

In a step S4-1, the pattern transfer process is started. In this state,the photocurable resin material 105 is applied onto the substrate 104and the mold 106 does not contact the (liquid) resin material 105.

In a step S4-2, alignment feedback control is started.

Next, in a step S4-3, when the contact of the mold 106 with thephotocurable resin material 105 is detected, in a step S4-4, thealignment feedback control is stopped.

After the feedback control is stopped, in a step S4-5, the stage 102 isdriven to bring the mold 106 and the substrate 104 close to each otherby a certain distance to effect gap adjustment between the opposingsurfaces of the mold 106 and the substrate 104.

After the contact transition state between the mold 106 and thephotocurable resin material 105 is completed, in a step S4-6, ameasurement/control parameter of the alignment feedback control ischanged and then, in a step S4-7, the alignment feedback control isresumed.

After the alignment feedback control is completed, in a step S4-8, thephotocurable resin material 105 is cured by UV light irradiation fromthe UV light source.

In a step S4-9, the mold 106 is released from the cured resin material105 and then, in a step S4-10, the pattern transfer process iscompleted.

Incidentally, in the case wherein the mold 106 satisfies the accuracyrequired for positional deviation by the contact with the photocurableresin material 105, it is also possible to perform only the measurementafter the contact, without effecting the feedback control.

Next, with reference to FIGS. 5(a) and 5(b), a change in positionmeasurement parameter for in-plane alignment as an example of the changein measurement/control parameter will be described.

As described above, FIG. 5(a) is a graph showing gradation values in acertain area of the image obtained by the scope 109 in the positiondetection circuit 115, and FIG. 5(b) is a graph showing a change of agradation value with time in the area. When the mold 106 contacts thephotocurable resin material 105, as shown in FIG. 5(b), the gradationvalue in the area is changed from G₁ to G₂.

Therefore, the gradation value is changed as a whole by the contact ofthe mold 106 with the photocurable resin material 105, so that detectionof the marks is difficult in some cases. For this reason, a thresholdvalue of the gradation value for the mark detection is corrected so thatthe marks can be detected in a state after the contact.

FIGS. 10(a) and 10(b) are schematic views illustrating a change in a gapmeasurement parameter as the distance measurement parameter foradjusting a distance (gap) between the mold 106 and the substrate 104.By the contact between the mold 106 and the photocurable resin material105, as shown in these figures, a substance between the mold 106 and thesubstrate 104 located below the scope 110 is changed from air to thephotocurable resin material 105. By this change of the substance, arefractive index in an optical path for measuring the gap is changed, sothat a gap (distance) measurement result can be an erroneous value. Forthis reason, the refractive index used for calculating the gap ischanged from that of air to that of the photocurable resin material 105.

FIGS. 11(a) and 11(b) are graphs illustrating a change in stage drivecontrol parameter as a drive control parameter for performing analignment operation between the mold and the substrate as anotherembodiment for changing the measurement/control parameter.

By the contact of the mold 106 with the photocurable resin material 105,as shown in FIG. 11(a), a pressure exerted between the mold 106 and thesubstrate 104 can be changed. In this case, a time T₄ represents acontact time of the mold 106 with the photocurable resin material 105.Before and after the contact of the mold 106 with the photocurable resinmaterial 105, the pressure exerted from the mold 106 and the control 104is changed from 0 to P₁.

With this pressure change, a pressure exerted on the stage is alsochanged, so that a parameter such as a gain, or the like, for drivingthe stage is corrected in order to drive the stage with high accuracy.

Further, the state of the pressure change during the pattern transfer isnot limited to that shown in FIG. 11(a), but can also be that shown inFIG. 11(b), in which the pressure is changed from P₂ to 0, so that thepressure can be applied so that the mold and the substrate attract eachother.

The change in measurement/control parameter for the alignment feedbackcontrol is not limited to using the change described above, but may alsobe a change corresponding to a physical change caused by the contact ofthe mold and the resin material with respect to the feedback control.

In this embodiment, in the alignment between the mold and the substrate104, the feedback control for the alignment is stopped simultaneouslywith the detection of the contact between the mold 106 and thephotocurable resin material 105. Then, the feedback control is resumedafter measurement/control parameter for the feedback control is changed.

By this operation, it is possible to reduce an occurrence of amalfunction of an alignment operation during the contact between themold 106 and the substrate 104. As a result, it is possible to performhigh-speed processing capable of reducing breakage of the mold and thesubstrate.

Incidentally, the step of changing the measurement/control parameter forthe feedback control is not limited to that in this embodiment, but mayalso be a step of changing a parameter in stages during the contactbetween the mold 106 and the photocurable resin material 105.

Embodiment 1-4

Next, an imprinting method and an imprinting apparatus in thisembodiment will be described.

A difference between this embodiment and Embodiment 1-3 is only anoperation sequence in the pattern transfer process, so that only thepattern transfer process will be described.

FIG. 12 is a flow chart illustrating steps for effecting feedbackcontrol in the pattern transfer process for imprinting the patternprovided to the mold.

In a step S5-1, the pattern transfer process is started. In this state,the photocurable resin material 105 is applied onto the substrate 104and the mold 106 does not contact the (liquid) resin material 105.

In a step S5-2, alignment feedback control is started.

Next, in a step S5-3, the feedback control is stopped when the mold 106and the photocurable resin material 105 applied onto the substrate 104are placed at predetermined positions in front of a contact positiontherebetween.

After the feedback control is stopped, in a step S5-4, the stage 102 isdriven to bring the mold 106 and the substrate 104 close to each otherto effect gap adjustment (gap control) between the opposing surfaces ofthe mold 106 and the substrate 104. That is, before the alignmentfeedback control is resumed (the control parameter is changed in a stepS5-6, performed later), the gap adjustment (gap control) is effected.

Next, in a step S5-5, the contact of the mold 106 with the resinmaterial 105 is detected and the measurement/control parameter for thealignment feedback control is changed in step S5-6, and thereafter, thealignment feedback control is resumed in a step S5-7.

After the alignment feedback control is completed, in a step S5-8, thephotocurable resin material 105 is cured by UV light irradiation fromthe UV light source.

In a step S5-9, the mold 106 is released from the cured resin material105 and then, in a step S5-10, the pattern transfer process iscompleted.

In this embodiment, in the in-plane alignment between the mold and thesubstrate 104, the feedback control for the alignment is stopped inadvance during the contact between the mold 106 and the photocurableresin material 105. Then, after detection of the contact, themeasurement/control parameter is changed and the feedback control isresumed.

By this operation, it is possible to reduce an occurrence of amalfunction of an alignment operation during the contact between themold 106 and the substrate 104. As a result, it is possible to performhigh-speed processing capable of reducing breakage of the mold and thesubstrate.

Further, as another alignment method, it is possible to employ thefollowing method.

First, a first member and a second member contacting a fluid materialare disposed opposite to each other. The first member may include theabove-described mold and a lens used for an immersion exposureapparatus. The fluid material may include the above-describedphotocurable resin material, a liquid, such as water, and a gel-likematerial. The second member may include, e.g., quartz or a wafer, suchas a semiconductor wafer, and may desirably be a flat plate-likematerial, such as a so-called Si wafer.

Next, as described above, in a state in which the first member and thesecond member contacting the fluid material are disposed opposite toeach other, alignment between the first member and the second member iseffected with feedback control. Here, the alignment may include at leastone of in-plane alignment of the first plate-like member and alignmentwith respect to a gap between the first member and the second member.

Then, while effecting the feedback control, the gap is graduallydecreased and by utilizing information about contact between the firstmember and the fluid material, the feedback control is stopped or acontrol condition in the feedback control is changed. Here, theinformation about the contact means information showing contact betweenthe first member and the fluid material, information showing a lapse ofa predetermined time after the contact, or information showing apredetermined state after the contact.

As described above, by stopping the feedback control or changing theparameter (condition) therefor, it is possible to prevent a malfunctioncaused by the contact between the first member and the fluid material(which are originally not in contact with each other, but are in contactwith each other during the alignment).

As a result, it is possible to realize an alignment method in which thefirst member and the second member contacting the fluid material aredisposed opposite to each other, and the alignment between the firstmember and the second member is effected with feedback control, and thenthe feedback control is stopped or the control condition in the feedbackcontrol is changed by utilizing the information about the contactbetween the first member and the fluid material.

The alignment method according to the present invention is applicable tonot only the above-described imprinting apparatus, but also, animmersion exposure apparatus, and the like.

Incidentally, the members or means described in Embodiment 1-1 toEmbodiment 1-4 with reference to FIG. 2 to FIG. 12 may include thecasing 101, the stage 102, the substrate holding portion 103, thesubstrate 104, the photocurable resin material 105, the mold 106, havinga pattern at its processing surface, the mold holding portion 107, andload cell 108, the scopes 109 and 110, the UV light source 111, thedispenser 112, the process control circuit (means) 113, the applicationcontrol circuit 114, the position detection circuit (means) 115, theexposure amount control circuit 116, the pressure detection circuit 117,and the position control circuit (means) 118.

Hereafter, embodiments according to the second aspect of the presentinvention will be described.

Embodiment 2-1

With reference to the drawings, Embodiment 2-1 will be describedspecifically.

Depending on the constitution and various conditions for an apparatus tobe applied, this embodiment may be appropriately modified or changed.

In this embodiment, a substrate onto which a resin material is appliedis brought into contact with a fixed mold by movement of a stage toeffect imprinting. Further, alignment between the mold and the substrateis effected by such a global method that several points are measured inadvance and a target position is set for each chip from a measurementresult.

FIG. 13 is a flow chart illustrating steps for performing imprintingwith respect to one chip.

In this embodiment, the mold and the substrate are brought near to eachother in a direction (z) perpendicular to their opposing surfaces on thebasis of a preset profile. This profile is set so that values of themold and the substrate in in-plane directions (x, y and 2) are kept atthe same levels.

First, in a step S6-1, the mold and the substrate, onto which the resinmaterial is applied, are disposed opposite to each other and are placedin an imprintable state.

In a step S6-2, a predetermined state is confirmed.

This state confirmation is performed by:

(1) measuring a load exerted on the mold or the substrate and measuringa torque of the stage,

(2) measuring a distance between the mold and the substrate and aposition of the stage,

(3) judging the presence or absence of contact between the mold and thesubstrate, or the like.

Next, in a step S6-3, a subsequent step is determined by judging whetheror not the information obtained in the step S6-2 satisfies a condition.This condition is, e.g., the case wherein a deviation between a targetposition and a current position and positional vibration are smallerthan set values.

When the condition is satisfied, the step goes to step S6-5. When thecondition is not satisfied, a change in control is made in a step S6-4.The change in control may include changes in a control parameter, adrive profile, and the like, of a control mechanism. The change incontrol may also include a change in control method for switching ON andOFF of feedback control.

After the change in control is made, the step goes to a step S6-5, inwhich a judgment, as to whether or not an end condition is satisfied, ismade. The end condition may include a state in which the stage islocated at a target value (position).

When the end condition is satisfied, the step goes to a step S6-7. Whenthe end condition is not satisfied, in a step S6-6, an attitude of thestage is controlled. This control is effected on the basis of the driveprofile after being changed with respect to the Z direction. In thiscase, depending on the profile, a start time of UV irradiation forcuring the resin material and an irradiation duration are changed.

Next, the control of the stage in this embodiment will be described.

FIGS. 14(a) to 14(c) are schematic diagrams illustrating the stagecontrol in this embodiment, in which FIG. 14(a) is a control blockdiagram, FIG. 14(b) is a diagram for illustrating a PI controlmechanism, and FIG. 14(c) is a time chart.

Referring to FIG. 14(a), a profiler sets a target value of the stage onthe basis of a preset stage drive profile. Into a control mechanism 1, areference signal (ref) sent from the profiler and a deviation (err)between the reference signal and a position measurement result areinputted. This control mechanism 1 is, e.g., a mechanism for PI controlwith respect to proportional and integral operations. Further, thecontrol block includes a switch (SW) capable of turning on and off afeedback switch.

FIG. 14(b) shows a constitution of the PI control, wherein Kp representsa proportional gain, Ti represents an integral time, and s represents aLaplace operator. Further, z is an inferior letter and represents az-axis parameter.

It is also possible not to effect the integral control by the switch.The control mechanism 1 further includes filters, such as a low-passfilter, a band-pass filter, and a notch filter, and is capable ofperforming setting of a filter parameter, such as the order andfrequency of the filters.

The signal sent from the control mechanism 1 is inputted into an objectto be processed. The object to be processed is each of the axes of thestage.

An actual signal is set to a motor for driving the stage. Into a judgingmechanism, data measured (detected) by a detecting mechanism such as notonly these for position measurement, but also, a load exerted on themold or the substrate. The judging mechanism provides an instruction tochange a control parameter or a drive profile for the substratemechanism 1. The control parameter includes any of a PID parameter, afeedforward parameter, and a filter parameter. The drive profile mayinclude not only a position of the stage, but also, an acceleration, aspeed, a drive voltage, and a drive speed of the stage.

With reference to FIG. 14(c), a stage of imprinting control will bedescribed. FIG. 14(c) shows a profile of z-position during imprinting,in which the substrate is brought near to the mold and the resinmaterial contacts the mold and is cured, and then, released from themold. Specifically, FIG. 14(c) is a time chart of a drive profile whenthe stage is moved in a direction of a normal (z) to the substrate.Other drive profiles with respect to in-plane direction (xy) of theportion and other axes (2∀∃) are also present. Incidentally, the xyprofile is a drive profile that keeps the same value.

In FIG. 14(c), (1) is an area in which the mold and the (liquid) resinmaterial on the substrate do not contact each other, (2) to (5) areareas in which the mold and the resin material contact each other, (6)is an area in which the resin material is cured by UV light, (7) is anarea in which the mold is released from the resin material, and (8) isan area in which the mold is retracted from the contact area.

In this case, a drive profile for the z direction is not changed. Bythis profile, when the z-position is moved, a time change (variation) inload exerted on the mold is observed. Based on data of the load, theproportional gain Kpz and the integral time Tiz with respect to the zdirection are changed. These states are inclusively shown in FIG. 14(c).The proportional gain and the integral time are set for each of theaxes. However, the state of change and the control for each axis areidentical, so that those for the z-axis are described as an example.

In the area (1), the load is not changed, since the mold and the resinmaterial do not contact each other.

In the area (2), the mold and the resin material contact each other. Thez-direction load is merely changed to a negligible degree, but a viscousresistance is increased. At this time, a deviation is liable to occur,so that the proportional gain is increased and the integral time isdecreased. In the case wherein a behavior immediately after the contactis not stabilized, it is also possible to set such a profile that thefeedback control is turned off in advance immediately before the contactis turned on after the contact. Further, when a stage speed issufficiently large or a viscosity is large, the load can be increasedwith the change in z-position.

In the area (3), the load exerted on the mold is increased with adecreasing distance between the mold and the resin material. In thisarea, depending on the load, the proportional gain is increased and theintegral time is decreased.

In the area (4), the load is decreased after a target value of thesubstrate becomes constant. In this area, depending on the load, theproportional gain is decreased and the integral time is increased. Thereis also the case wherein there is no load-decreasing area depending onan application state of the resin material.

In the area (5), a substantially steady state is established. The loadcan be a negative value showing an attractive force. The load value ischanged depending on a gap between the mold and the substrate, an amountof the resin material, and a contact area of the resin material. Forexample, the load value is changed by a difference in resin amount amongthe case wherein a sufficient amount of the resin material is present ateven the outside of the mold, the case wherein the resin material ispresent in a region close to edges of the mold, and the case wherein theresin material is present only at a part of the mold. Incidentally, adecrease in load by diffusion of the resin material is less apt to givea reason for the negative value. Such a phenomenon that the load becomesthe negative value is characteristic of the imprinting in recent years.This may be attributable to the use of a low-viscosity resin material, agap of about several tens of nanometers, no application of a largepressure to the mold and the resin material, and the like. Accordingly,the reason why the load becomes the negative value can be consideredthat the load is largely affected by a surface tension or a capillaryaction. Depending on the load, the control parameter is set.

In the area (6), UV irradiation is performed. By the UV irradiation, theviscosity of the resin material is increased, with the result that theresin material is solidified. In the case wherein the value is deviatedfrom the target value, the value is not returned to the target valueuntil the stage is largely moved. For this reason, the proportional gainis increased and the integral time is decreased. Incidentally, in thecase wherein the load requires a time to be placed in a steady state,the UV irradiation may also be performed before the load is placed inthe steady state, depending on the load, the deviation, or the time.

In the area (7), the release between the mold and the substrate isstarted, but the mold and the resin material are separated from eachother. In this area, the control parameter is changed depending on theload.

In the area (8), the mold and the substrate are separated from eachother. In this case, the load is not changed, so that the controlparameter is constant.

Incidentally, setting of the change is determined by performingimprinting for knowing a condition in advance. For example, there arethe following four cases (1) to (4);

(1) in the case wherein the mold contacts the resin material and theload is not changed, the proportional gain is kept at a constant value,

(2) in the case wherein the mold contacts the resin material and theload is changed, the proportional gain is changed depending on thechange.

(3) in the case wherein the resin material is cured, the proportionalgain is kept at a constant level, and

(4) in the case wherein the release is performed, the proportional gainis changed depending on the load.

A value for judging the condition may include, in addition to a changein detected value, a change in differential coefficient (including achange in sign), a second-order differential coefficient (including achange in sign), and the like.

The above-described drive profile and control parameter are described asan example, so that they may be changed depending on a component,viscosity, amount, and the like, of the resin material.

Next, an imprinting apparatus in this embodiment, to which the presentinvention is applied, will be described. FIG. 15 shows a constitution ofthe imprinting apparatus. Referring to FIG. 15, the imprinting apparatusincludes an exposure light source 301, a mold molding portion 302, asubstrate holding portion 303, a substrate lifting mechanism 304, anin-plane moving mechanism 305, an optical system 306 for measuring arelative position between the mold and the substrate, and an analyzingmechanism 309 for calculating the relative position.

In the global method in this embodiment, the drive profile of the stageis set for each chip on the basis of a measurement result.

The optical system 306 is capable of measuring the presence or absenceof contact between the mold and the resin material. For example, thereis a method in which entrance of the resin material into a picture areais observed and a method in which a change in amount of light enteringthe resin material is observed.

The imprinting apparatus further includes a load cell 307 and aninterference meter 308 for measuring a displacement.

Also, by this interference meter, it is possible to measure the presenceor absence of contact of the resin material. For example, there is amethod in which an oscillation component of an interferometer or anamplitude of noise is measured, and the resin material is judged tocontact the mold by a decrease in degree of the oscillation due to thecontact of the resin material. As another measuring method, it is alsopossible to employ a method in which a torque of a motor for the stageis measured. The torque can be calculated by measuring a current appliedto the motor.

The imprinting apparatus includes a mold 311, a substrate 312, and aphotocurable resin material 313. The mold holding portion 302 effectschucking of the mold 311 by a vacuum chucking method, or the like. Thesubstrate 312 is movable to a desired position by the in-plane movingmechanism 305, and by the substrate lifting mechanism 304, heightadjustment and pressure application with respect to the substrate 312can be performed.

Control of the position measurement, pressure application, lightexposure, and the like, with respect to the substrate 312, are performedby an imprinting control mechanism 310. The imprinting control mechanism310 includes the profiler, the judging mechanism and the controlmechanism shown in FIG. 14(a).

Embodiment 2-2

With reference to the drawings, Embodiment 2-2 of the present inventionwill be described.

In this embodiment, the case wherein a control condition is differentbetween x-direction and z-direction will be described.

FIG. 17 shows a mold 1700 having a line-and-space pattern in thisembodiment.

In FIG. 17, the x-direction is a line direction and the y-direction is adirection perpendicular to the line direction. In such a structure, theresin material is liable to extend in the x-direction and is less liableto extend in the y-direction. In this case, a change in controlcondition, such as a control parameter, a control method, a driveprofile, or the like, for each axis, is particularly effective. Here,the resin material is less liable to extend in the y-direction, so thatthe case wherein the mold receives a pressure in the y-direction tocause a deviation in the y-direction will be considered. However, thisrelationship is affected by a surface treatment and shape of the moldand a characteristic of the resin material, so that the deviation isliable to occur in the x-direction, in some cases.

In this embodiment, similarly as in Embodiment 2-1, a substrate ontowhich a resin material is applied is brought into contact with a fixedmold by movement of a stage to effect imprinting. Further, alignmentbetween the mold and the substrate is effected by a die-by-die methodperformed for each chip. In the die-by-die method, the alignment iseffected while measuring a change in in-plane relating position betweenthe mold and the substrate is measured for each chip.

FIG. 18 is a flow chart illustrating steps for performing imprintingwith respect to one chip.

In this embodiment, the mold and the substrate are brought near to eachother in a direction (z) perpendicular to the substrate on the basis ofa preset drive profile. This drive profile is set so that values of themold and the substrate in in-plane directions (x, y and 2) are kept atthe same levels.

First, in a step S8-1, the mold and the substrate, onto which the resinmaterial is applied, are disposed opposite to each other and are placedin an imprintable state by measuring a relative position between themold and the substrate and effecting alignment therebetween so as toprovide their described positions.

Next, the step goes to a z-control step S8-2 and an xy-control stepS8-4. These steps are so-called parallel control.

In the step S8-4, an xy-state is confirmed.

The xy-state is confirmed by measuring a load exerted on the mold or thesubstrate and measuring a relative distance between the mold and thesubstrate.

Next, in a step S8-5, a subsequent step is determined by judging thatany of the following three conditions (1), (2) and (3) is satisfied.These conditions are: (1) a case wherein a deviation between a targetposition and a current position and positional vibration are smallerthan set values; (2) a case wherein these values are larger than the setvalues; and (3) a case of an end condition.

In the case wherein the step goes from the step S8-5 to the step S8-6,in the step S8-6, the control condition with respect to the xy-directionis changed so as to always be within a predetermined value.

In the case wherein the step goes from the step S8-2 to a step S8-3, inthe step S8-3, a condition 4 is whether or not an end condition issatisfied. When the end condition is not satisfied, the z-control iseffected in the step S8-2. When the end condition is satisfied, the stepgoes to a step S8-7, in which the step is completed.

Next, imprinting in this embodiment will be described.

FIG. 19 is a time chart for illustrating a state of the imprinting inthis embodiment, wherein a drive profile is not changed. The time chartincludes a z-position profile, a change with time of a load exerted onthe mold, a proportional gain Kpx with respect to the x-direction on thebasis of the load data, and a proportional gain Kpy with respect to they-direction.

In the area (1), the load is not changed, since the mold and the resinmaterial do not contact each other. In this area, the control parameteris identical.

In the area (2), the mold and the resin material contact each other, butthe z-direction load is merely changed to a negligible degree. The resinmaterial is liable to diffuse in the x-direction, but is less liable todiffuse in the y-direction, so that a deviation is liable to occur byfluidity of the resin material. In this case, with respect to they-direction, the proportional gain is increased, as compared with thatwith respect to the x-direction.

In the area (3), the load exerted on the mold is increased with adecreasing distance between the mold and the resin material. In thisarea, depending on the load, the proportional gain is increased withrespect to the y-direction. With respect to the x-direction, a constantproportional gain is set, irrespective of the load.

In the area (4), the load is decreased after a target value of thesubstrate becomes constant. In this area, depending on the load, theproportional gain with respect to the y-direction is decreased. Withrespect to the x-direction, a constant proportional gain is set,irrespective of the load.

In the area (5), a substantially steady state is established. The loadcan be a negative value showing an attractive force. Depending on theload, the control parameter is set with respect to each of the x- andy-directions.

In the area (6), UV irradiation is performed. Incidentally, in the casewherein the load requires a time to be placed in a steady state, the UVirradiation may also be performed before the load is placed in thesteady state, depending on the load, the deviation, or the time. By theUV irradiation, the resin material contracts or expands. With respect tothe y-direction, a positional error is liable to occur the by influenceof the contraction or the expansion, so that the proportional gain isincreased. By the UV irradiation, a change in the load can be caused tooccur. Specifically, depending on the resin material component or acontact state of the resin material with the mold, the load is left at anegative value or changed from the negative value to a positive value,in some cases. These phenomena are reproducible, so that a change incontrol method, such as switching (ON/OFF) of feedback control is made,corresponding to a state of the change.

In the area (7), the release between the mold and the substrate isstarted, but the mold and the resin material are separated from eachother. In this area, the resin material is solidified, so that aconstant proportional gain is set with respect to both of the x- andy-directions.

In the area (8), the mold and the substrate are separated from eachother. In this case, the load is not changed, so that the proportionalgain is constant.

Embodiment 2-3

With reference to the drawing, Embodiment 2-3 of the present inventionwill be described.

In this embodiment, a control condition, including a combination of feedforward control and feedback control, is employed.

In the imprinting, a part of factors capable of becoming a cause of adisturbance, such as control between the mold and the resin material, UVirradiation, and the like, is known in advance, so that the controlcondition described above is effective in such a case of an occurrenceof the disturbances.

Particularly, in the case wherein only the feedback control is employed,it takes time to detect an influence of the disturbance after thedisturbance occurs. The control condition including the combination ofthe feedforward control and the feedback control is effective forobviating a delay in response.

FIGS. 20(a) to 20(c) are schematic diagrams illustrating the stagecontrol in this embodiment, in which FIG. 20(a) is a control blockdiagram, FIG. 20(b) is a diagram for illustrating a PI controlmechanism, and FIG. 20(c) is a time chart.

Referring to FIG. 20(a), a profiler sets a target value of the stage onthe basis of a preset stage drive profile. Into a control mechanism 2, areference signal (ref) sent from the profiler and a deviation (err)between the reference signal and a position measurement result areinputted. This control mechanism 2 is, e.g., a mechanism for PID controlwith respect to proportional and integral.

FIG. 20(b) shows a constitution of the PID control, wherein Kprepresents a proportional gain, Ti represents an integral time, Tdrepresents a derivative time, and s represents a Laplace operator.

The control mechanism 2 further includes filters, such as a low-passfilter, a band-pass filter, and a notch filter, and is capable ofperforming setting of filter parameters, such as the order and frequencyof the filters.

The signal sent from the control mechanism 2 is inputted into an objectto be processed. The object to be processed is each of axes of thestage.

An actual signal is set to a motor for driving the stage. Into a judgingmechanism, data may be measured (detected) by a detecting mechanism,such as not only these for position measurement, but also, a loadexerted on the mold or the substrate.

Further, into a control mechanism 3, a z-correction signal is inputtedfrom the profiler. This is effective in the case wherein a signal isintended to be added under a condition other than that for the controlmechanism 2. The control mechanism 3 is constituted by a proportionalgain and a filter. The judging mechanism provides an instruction tochange a control parameter or a drive profile for the substratemechanisms 2 and 3.

With reference to FIG. 20(c), a state of imprinting control will bedescribed. In this embodiment, a profile of the z-position is notchanged, but a control parameter and a z-correction profile are changed.The time chart includes the z-position profile, the z-correctionprofile, a change with time of a load exerted on the mold, and amodified example of the derivative time Td on the basis of the loaddata.

In the area (1), the load is not changed, since the mold and the resinmaterial do not contact each other.

In the area (2), the mold and the resin material contact each other, butthe load is merely changed to a negligible degree. In order to suppressthe disturbance occurring before and after the contact, the derivativetime Td is increased at a boundary between the areas (1) and (2).

In the area (3), the load exerted on the mold is increased with adecreasing distance between the mold and the resin material. In thisarea, the load is steadily changed, so that the derivative time Td isset from a boundary between the areas (2) and (3). Further, in the caseof increasing the deviation, the target value is corrected.

In the area (4), the resin material is diffused, and the load isdecreased after a target value of the substrate becomes constant. Also,in the area, the derivative time Td is set.

In the area (5), a substantially steady state is established. Also, inthis area, the derivative time Td is set.

In the area (6), UV irradiation is performed. Before and/or after the UVirradiation, the disturbance occurs, so that the derivative time Td isset at a boundary between the areas

(5) and (6).

In the area (7), the release between the mold and the substrate isstarted, but the mold and the resin material are separated from eachother. In this area, the load is steadily changed, so that thederivative time Td is set.

In the area (8), the mold and the substrate are separated from eachother. In this case, the load is not changed, so that the derivativetime Td is constant.

Incidentally, the control conditions for the boundaries between theareas (2) and (3) and between the areas (4) and (5), such as the controlparameter, the drive profile, and the control method, can be roughlyestimated by performing imprint for determining the conditions.

In the embodiments described with reference to FIG. 13 to FIG. 20(c),the members and means for the imprinting method and the imprintingapparatus of the present invention include the exposure light source301, the mold holding portion 302, the substrate holding portion 303,the substrate lifting mechanism 304, the in-plane moving mechanism 305,the optical system 306, and load cell 307, the interferometer 308, theanalyzing mechanism 309, the imprint control mechanism 310, the mold311, the substrate 312, and the photocurable resin material 313.

INDUSTRIAL APPLICABILITY

As described above, according to the present invention, it is possibleto effect alignment control suitable for an imprinting process.

While the invention has been described with reference to the structuresdisclosed herein, it is not confined to the details set forth and thisapplication is intended to cover such modifications or changes as maycome within the purpose of the improvements or the scope of thefollowing claims.

We claim:
 1. A method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing the member and the uncured material on a substrate into contact with each other is cured, the method comprising: a step of bringing the member and the substrate near to each other while effecting the alignment control, based on a driving profile, after the alignment control is started, to bring the member and the uncured material into contact with each other, and then the uncured material is cured; and a step of increasing a gap between the member and the substrate, after the uncured material is cured, wherein the driving profile for the alignment control after the alignment control is started and at least one of before and after the member contacts the uncured material is changed.
 2. A method according to claim 1, wherein the driving profile for the alignment control includes at least one of an acceleration, a speed, a driving voltage, and a driving current.
 3. A method according to claim 1, further comprising a detecting step of detecting contact between the member and the uncured material, wherein the driving profile is changed according to the detecting step of detecting contact between the member and the uncured material.
 4. A method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing the member and the uncured material on a substrate into contact with each other is cured, the method comprising: a step of contacting the member and the uncured material to each other by bringing the member and the substrate near to each other while effecting the alignment control based on a driving profile; a step of bringing the member, contacting the uncured material, and the substrate further near to each other; a step of curing the uncured material in a state in which the member and the substrate are brought further near to each other; and a step of increasing a gap between the member and the substrate, after the uncured material is cured, wherein the driving profile for the alignment control is changed, in a period from the time when the member and the substrate are brought near to each other until the time when the member brought into contact with the uncured material and the substrate are brought further near to each other.
 5. A method according to claim 4, wherein the driving profile for the alignment control includes at least one of an acceleration, a speed, a driving voltage, and a driving current.
 6. A method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing the member and the uncured material on a substrate into contact with each other is cured, the method comprising: a step of bringing the member and the substrate near to each other while effecting the alignment control, based on a control parameter, after the alignment control is started, to bring the member and the uncured material into contact with each other, and then the uncured material is cured; and a step of increasing a gap between the member and the substrate, after the uncured material is cured, wherein the control parameter for the alignment control after the alignment control is started and at least one of before and after the member contacts the uncured material is changed.
 7. A method according to claim 6, wherein the control parameter for the alignment control includes at least one of a PID parameter, a feedforward parameter, and a filter parameter.
 8. A method according to claim 6, wherein the control parameter for the alignment control is a proportional gain.
 9. A method according to claim 8, wherein the proportional gain used for the alignment control after the member and the uncured material are contacted to each other is greater than that before the member and the uncured material are contacted to each other.
 10. A method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing the member and the uncured material on a substrate into contact with each other is cured, the method comprising: a step of contacting the member and the uncured material to each other by bringing the member and the substrate near to each other while effecting the alignment control based on a driving profile; a step of bringing the member, contacting the uncured material, and the substrate further near to each other; a step of curing the uncured material in a state in which the member and the substrate are brought further near to each other; and a step of increasing a gap between the member and the substrate, after the uncured material is cured, wherein the control parameter for the alignment control is changed, in a period from the time when the member and the substrate are brought near to each other until the time when the member brought into contact with the uncured material and the substrate are brought further near to each other.
 11. A method according to claim 10, wherein the control parameter for the alignment control includes at least one of a PID parameter, a feedforward parameter, and a filter parameter.
 12. A method according to claim 10, wherein the control parameter for the alignment control is a proportional gain.
 13. A method according to claim 12, wherein the proportional gain used for the alignment control after the member and the uncured material are contacted to each other is greater than that before the member and the uncured material are contacted to each other.
 14. A method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing the member and the uncured material on a substrate into contact with each other is cured, the method comprising: a step of bringing the member and the substrate near to each other while effecting the alignment control, based on a driving profile, after the alignment control is started, to bring the member and the uncured material into contact with each other, and then the uncured material is cured; and a step of increasing a gap between the member and the substrate, after the uncured material is cured, wherein the driving profile for the alignment control after contact of the member and the uncured material is different from the driving profile for the alignment control before the contact of the member and the uncured material.
 15. A method according to claim 14, wherein the driving profile for the alignment control includes at least one of an acceleration, a speed, a driving voltage, and a driving current.
 16. A method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing the member and the uncured material on a substrate into contact with each other is cured, the method comprising: a step of contacting the member and the uncured material to each other by bringing the member and the substrate near to each other while effecting the alignment control based on a driving profile; a step of bringing the member, contacting the uncured material, and the substrate further near to each other; a step of curing the uncured material in a state in which the member and the substrate are brought further near to each other; and a step of increasing a gap between the member and the substrate, after the uncured material is cured, wherein the driving profile for the alignment control after contact of the member and the uncured material is different from the driving profile for the alignment control before the contact of the member and the uncured material.
 17. A method according to claim 16, wherein the driving profile for the alignment control includes at least one of an acceleration, a speed, a driving voltage, and a driving current.
 18. A method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing the member and the uncured material on a substrate into contact with each other is cured, the method comprising: a step of bringing the member and the substrate near to each other while effecting the alignment control, based on a control parameter, after the alignment control is started, to bring the member and the uncured material into contact with each other, and then the uncured material is cured; and a step of increasing a gap between the member and the substrate, after the uncured material is cured, wherein the control parameter for the alignment control after contact of the member and the uncured material is different from the control parameter for the alignment control before the contact of the member and the uncured material.
 19. A method according to claim 18, wherein the control parameter for the alignment control includes at least one of a PID parameter, a feedforward parameter, and a filter parameter.
 20. A method according to claim 18, wherein the control parameter for the alignment control is a proportional gain.
 21. A method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing the member and the uncured material on a substrate into contact with each other is cured, the method comprising: a step of contacting the member and the uncured material to each other by bringing the member and the substrate near to each other while effecting the alignment control based on a driving profile; a step of bringing the member, contacting the uncured material, and the substrate further near to each other; a step of curing the uncured material in a state in which the member and the substrate are brought further near to each other; and a step of increasing a gap between the member and the substrate, after the uncured material is cured, wherein the control parameter for the alignment control after contact of the member and the uncured material is different from the control parameter for the alignment control before the contact of the member and the uncured material.
 22. A method according to claim 21, wherein the control parameter for the alignment control includes at least one of a PID parameter, a feedforward parameter, and a filter parameter.
 23. A method according to claim 21, wherein the control parameter for the alignment control is a proportional gain.
 24. A method of manufacturing an article, the method comprising: a step of bringing a member and a substrate near to each other while effecting an alignment control with respect to an in-plane direction of the substrate and an uncured material, based on a driving profile, after the alignment control is started, and of bringing the member and the uncured material into contact with each other; a step of curing the uncured material to form a layer; a step of increasing a distance between the member and the substrate, after the uncured material is cured; and a step of processing the substrate on which the layer has been formed to produce the article, wherein the driving profile for the alignment control after the alignment control is started and at least one of before and after the member contacts the uncured material is changed.
 25. A method according to claim 24, wherein the driving profile for the alignment control includes at least one of an acceleration, a speed, a driving voltage, and a driving current.
 26. A method according to claim 24, wherein the driving profile is changed after the member contacts the uncured material and before the uncured material is cured.
 27. A method according to claim 24, wherein the driving profile is changed before the member contacts the uncured material, and the driving profile after the contact of the member and the uncured material is different from the driving profile before the driving profile is changed.
 28. A method of manufacturing an article, the method comprising: a step of bringing a member and a substrate near to each other while effecting an alignment control with respect to an in-plane direction of the substrate and an uncured material, based on a control parameter, after the alignment control is started, and of bringing the member and the uncured material into contact with each other; a step of curing the uncured material to form a layer; a step of increasing a distance between the member and the substrate, after the uncured material is cured; and a step of processing the substrate on which the layer has been formed to produce the article, wherein the control parameter for the alignment control after the alignment control is started and at least one of before and after the member contacts the uncured material is changed.
 29. A method according to claim 28, wherein the control parameter for the alignment control includes at least one of a PID parameter, a feedforward parameter, and a filter parameter.
 30. A method according to claim 28, wherein the control parameter for the alignment control is a proportional gain.
 31. A method according to claim 30, wherein the proportional gain used for the alignment control after the member and the uncured material are contacted to each other is greater than that before the member and the uncured material are contacted to each other.
 32. A method according to claim 28, wherein the driving profile is changed after the member contacts the uncured material and before the uncured material is cured.
 33. A method according to claim 28, wherein the driving profile is changed before the member contacts the uncured material, and the driving profile after the contact of the member and the uncured material is different from the driving profile before the driving profile is changed.
 34. A method of manufacturing an article, the method comprising: a step of bringing a member and a substrate near to each other while effecting an alignment control with respect to an in-plane direction of the substrate and an uncured material, based on a driving profile, after the alignment control is started, and of bringing the member and the uncured material into contact with each other; a step of curing the uncured material to form a layer; a step of increasing a distance between the member and the substrate, after the uncured material is cured; and a step of processing the substrate on which the layer has been formed to produce the article, wherein the driving profile for the alignment control after contact of the member and the uncured material is different from the driving profile for the alignment control before the contact of the member and the uncured material.
 35. A method according to claim 34, wherein the driving profile for the alignment control includes at least one of an acceleration, a speed, a driving voltage, and a driving current.
 36. A method according to claim 34, wherein the driving profile is changed after the member contacts the uncured material and before the uncured material is cured.
 37. A method according to claim 34, wherein the driving profile is changed before the member contacts the uncured material, and the driving profile after the contact of the member and the uncured material is different from the driving profile before the driving profile is changed.
 38. A method of manufacturing an article, the method comprising: a step of bringing a member and a substrate near to each other while effecting an alignment control with respect to an in-plane direction of the substrate and an uncured material, based on a control parameter, after the alignment control is started, and of bringing the member and the uncured material into contact with each other; a step of curing the uncured material to form a layer; a step of increasing a distance between the member and the substrate, after the uncured material is cured; and a step of processing the substrate on which the layer has been formed to produce the article, wherein the control parameter for the alignment control after contact of the member and the uncured material is different from the control parameter for the alignment control before the contact of the member and the uncured material.
 39. A method according to claim 38, wherein the control parameter for the alignment control includes at least one of a PID parameter, a feedforward parameter, and a filter parameter.
 40. A method according to claim 38, wherein the control parameter for the alignment control is a proportional gain.
 41. A method according to claim 38, wherein the driving profile is changed after the member contacts the uncured material and before the uncured material is cured.
 42. A method according to claim 38, wherein the driving profile is changed before the member contacts the uncured material, and the driving profile after the contact of the member and the uncured material is different from the driving profile before the driving profile is changed. 